Adhesion Measurement of Films & Coatings Vol.2 - download pdf or read online

By Kash L. Mittal

ISBN-10: 9067643378

ISBN-13: 9789067643375

This e-book records the complaints of the Second overseas Symposium on Adhesion dimension of flicks and Coatings, held in Newark, NJ, October 25-27, 1999. because the First Symposium (Boston 1992) there have been enormous job in devising new, extra trustworthy and extra effective how you can degree adhesion of flicks and coatings, which ended in the choice to arrange the Newark Symposium. movies and coatings are used for quite a few reasons – sensible, ornamental, protecting, and so on. – in a bunch of functions. regardless of the aim or software of a movie or a coating, their enough adhesion to the underlying substrates is of paramount value. Concomitantly, the necessity to strengthen options for quantitative overview of adhesion of movies and coatings is all too seen. This quantity features a overall of 20 papers, that have all been conscientiously peer reviewed and certainly converted sooner than inclusion. the subjects contain: size and research of interface adhesion; relative adhesion dimension for skinny movie constructions; adhesion checking out of difficult coatings by means of various suggestions; demanding situations and new instructions in scratch adhesion checking out of lined substrates; program of scratch attempt to various movies and coatings; assessment of coating-substrate adhesion through indentation experiments; dimension of interfacial fracture strength in multifilm functions; laser caused decohesion spectroscopy (LIDS) for measuring adhesion; pulsed laser approach for evaluation of adhesion; blade adhesion attempt; JKR adhesion try; coefficient of thermal growth dimension; and residual stresses in diamond motion pictures. This quantity, offering the newest info, might be of serious price and curiosity to a person operating within the region of adhesion dimension of flicks and coatings.

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Extra resources for Adhesion Measurement of Films & Coatings Vol.2

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In order to model such stresses, free standing thin film mechanical properties (inplane and out-of-plane) are needed as a function of process and use conditions. In today’s microelectronic structures the film thicknesses are regularly less than 1pm. This causes nearly insurmountable problems with mechanical properties characterization as the techniques available today (nanoindentation, for example) are plagued with problems resulting in measurement inaccuracies. Besides, it is difficult, if not impossible, to make free standing films of submicrometer thick layers.

P. Buchwalter Figure 12. A schematic of crack initiation and growth during MELT testing of low k ILD/Si02 sample. See text for the number assignments. In Figure 12 a general type of crack initiation and propagation is shown for low k ILD (=interlayer dielectric)/Si02 samples tested in our laboratories. The crack initiation may start somewhere at the edge (1) or corner (4) of the sample. The crack growth may follow the path (1) to ( 2 ) to (3). Even though the cooling rate is monotonic, the crack growth often is not.

B. Mirman. Trans. Packaging, 117, 340 (1995). O. Shaffer, 11. J. McGarry. andF. Trusell. 308, 535 (1993). J. O. Shaffer, 11. Synzp. Proc.. 356, 515 (1995). E. Adhesion Adhesives. 16. 121 (1996). Volinsky. I. D. W. W. , 539. 217 (1999). J. Kinloch, Adhesion and Adhesiws. Science and Technology. Chapman and Hall, New York (1990). N. , 6 , 151 (1981 ). N. Adhesion Adhesives, 175 (April 1981). N. Gent. Adhesives Age, 27 (February 1982). A. N. Gent. Ed.. 13, 1285 (1975). L. Buchwalter, Personal communication (1999).

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